ASUS graphics card engineering leads the industry once again with the introduction of DirectCU II SSU thermal design. Comprising two “S” and one “U” shapes, the new heatpipes are precision shaped for optimal efficiency and heat transference. They are also nickel-plated to minimize oxidization, with their mid-section now placed directly over the GPU die. This design shortens heat transfer travel to lower thermal resistance and create bi-directional flow for up to twice the cooling capacity in the same space as that required by existing graphics card cooler designs. High-conductivity copper used in heatpipe formulation creates tube-like vapor chambers, moving heat to a large aluminum heatsink that features extended fins for multiple points of dissipation. The assembly is further chilled by two high performance but carefully-tuned and sound-dampened fans for faster and quieter cooling.